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Huawei technologies stories

Oct 5, 2026

Qualcomm to pay Huawei for patents in multi-year licensing deal covering 5G and AI

US chip giant Qualcomm has agreed to pay China's Huawei Technologies to license patents for the first time as part of a multi-year agreement covering 5G, artificial intelligence, computing, and networking technologies. The deal marks a reversal from the previous one-way licensing relationship where Huawei paid Qualcomm, and will require US regulatory approval.

Oct 5, 2026·6 sources
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Sep 30, 2026

DeepSeek releases software tools for Huawei AI chips to challenge Nvidia

Chinese AI lab DeepSeek has publicly open-sourced software development tools created in partnership with Huawei Technologies for programming the company's Ascend AI chips. The release marks a significant step in China's effort to build alternatives to Nvidia's dominant hardware and CUDA software ecosystem.

Sep 30, 2026·4 sources
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Sep 16, 2026

Huawei announces 2027 launch for new AI chips targeting Nvidia

Huawei Technologies will launch two new AI semiconductors in 2027 as the Chinese tech giant builds up its AI computing business to compete with Nvidia despite US export controls.

Sep 16, 2026·3 sources
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Sep 8, 2026

Huawei goes to trial in New York on criminal charges after eight years

Chinese tech giant Huawei Technologies is standing trial in Brooklyn federal court on criminal charges including racketeering and defrauding banks over its business dealings with Iran. The case, originally brought during the first Trump administration, comes to trial after nearly a decade of legal proceedings, just weeks before a scheduled meeting between President Trump and Chinese leader Xi Jinping.

Sep 8, 2026·5 sources
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Aug 26, 2026

Huawei pitches Egypt on building AI data centers for military and surveillance use

China's Huawei Technologies has submitted a proposal to the Egyptian government to build AI data centers for military, surveillance, and public sector applications. The move has drawn alarm in Washington, where officials are working to assemble a counter-offer.

Aug 26, 2026·3 sources
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Top claims

  • ▪A semiconductor teardown of Huawei's Kirin 9050 Pro chip by Geekerwan on October 3, 2026, confirmed the physical existence of a two-die vertical stack using copper-to-copper hybrid bonding at a 1.5-micron pitch.
  • ▪Huawei's LogicFolding architecture achieves transistor density gains by stacking silicon vertically rather than shrinking transistors horizontally, designed to bypass U.S. sanctions restricting access to advanced lithography equipment.
  • ▪Qualcomm's patent deal with Huawei is a concession of Western technological leadership

Topics

Technology transferSemiconductor industryAIInternational tradeU.S.–China relationsAI tools & productsCompute, chips & AI infrastructureOpen-source AIChina tech & industrial strategySemiconductor manufacturingAI antitrust & competitionExport controlsSanctions & economic countermeasuresChina global influence & soft powerAI Data Center Gold RushAI privacy & surveillanceAI geopoliticsMilitary AI applications

Related entities

United StatesChinaChinaIranBrooklynEgyptWashington