Aug 30, 2026
Semicon Taiwan 2026 highlights AI chip interconnect challenges and co-packaged optics
Semicon Taiwan 2026 opened August 31 in Taipei, drawing over 100,000 semiconductor professionals from 65 countries. The event spotlighted co-packaged optics and silicon photonics as critical technologies for addressing AI infrastructure bandwidth demands, with Samsung unveiling its 3D memory roadmap for AI applications.
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