Memory technology stories

Aug 4, 2026

SK hynix and SanDisk Release First High Bandwidth Flash (HBF) Standard Specification for AI Systems

SK hynix and SanDisk unveiled the first technical specification for High Bandwidth Flash (HBF), a new memory technology designed to bridge the performance gap between HBM and SSDs in AI accelerators, offering up to 3 TB/s bandwidth and terabyte-scale capacity. The specification was announced at the FMS 2026 conference, six months after the consortium's formation, with support from Google and Tenstorrent.

Aug 4, 20268 sources

Aug 3, 2026

Samsung Unveils Next-Generation AI Memory Technologies Including zHBM and 400-Layer NAND at FMS 2026

Samsung Electronics introduced breakthrough memory technologies at the Future of Memory and Storage conference, including zHBM (vertically stacked high-bandwidth memory on GPUs offering 4x data transfer speed) and a 400-plus-layer V10 Bonding V-NAND prototype, aimed at addressing AI infrastructure performance bottlenecks.

Aug 3, 20266 sources