Chinese semiconductor equipment manufacturer Naura Technology Group announces a breakthrough in 3D DRAM etching equipment, offering ChangXin Memory Technologies (CXMT) a domestic path to scale advanced memory production. CXMT, which holds a 7.7% global DRAM market share and raised 57.9 billion yuan in its 2026 IPO, aims to double its 300,000 wafer-per-month capacity and mass-produce HBM3 by late 2026 despite tight US export controls.
Naura 3D DRAM etching breakthrough
- ▪Naura Technology Group achieved a semiconductor equipment breakthrough to assist ChangXin Memory Technologies in producing advanced 3D DRAM chips.
- ▪Naura Technology Group's semiconductor equipment development is oriented toward enabling 3D DRAM fabrication and supporting high-bandwidth memory stacking.
- ▪Naura Technology Group has not publicly disclosed granular details, performance benchmarks, or production timelines for its announced 3D DRAM equipment breakthrough.
US semiconductor export controls
- ▪United States export restrictions block Chinese chipmakers like ChangXin Memory Technologies from accessing cutting-edge foreign equipment, including extreme ultraviolet lithography machines.
- ▪The United States has progressively tightened export controls on semiconductor technology to China since 2022, restricting finished chips and manufacturing equipment.
CXMT production capacity expansion
- ▪ChangXin Memory Technologies operates multiple 12-inch DRAM fabrication facilities with a combined capacity of approximately 300,000 wafers per month.
- ▪ChangXin Memory Technologies raised approximately 57.9 billion yuan in its 2026 initial public offering on the Shanghai Stock Exchange to expand DRAM wafer production lines.
- ▪ChangXin Memory Technologies plans to double its production capacity from its current level of approximately 300,000 wafers per month.
CXMT market share growth
- ▪ChangXin Memory Technologies has become the world's fourth-largest DRAM producer, holding a global market share of approximately 7.7%.
- ▪ChangXin Memory Technologies has achieved yield rates above 90% on certain DDR5 products, which have demonstrated competitive performance on AMD platforms.
HBM3 mass production timeline
- ▪ChangXin Memory Technologies is targeting the mass production of high-bandwidth memory HBM3 chips by late 2026.
- ▪The high-bandwidth memory market is currently dominated by South Korean chipmaker SK Hynix.
Global DRAM market competition
- ▪The global DRAM market is dominated by three major players: Samsung, SK Hynix, and Micron.
- ▪US-based chipmaker Micron has been partially banned from Chinese government procurement, complicating its relationship with the Chinese market.
Debatable claims
- ▪China will achieve self-sufficiency in advanced semiconductor manufacturing
- ▪US semiconductor export controls are failing to block Chinese technological advancement
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