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High Bandwidth Memory (HBM) stories

Jul 25, 2026

Samsung Electronics Secures $200 Billion Broadcom Partnership for AI Chips and Foundry Services Through 2030

Broadcom and Samsung Electronics signed a $200 billion MOU through 2030 covering AI chip production, 2nm foundry manufacturing, advanced packaging, and HBM supply. The deal was announced at the AI Summit in San Francisco.

Jul 25, 2026·8 sources
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Top claims

  • ▪Samsung Electronics began mass-producing and shipping HBM4 in February 2026, utilizing 10-nanometer-class sixth-generation DRAM and 4-nanometer base die technology
  • ▪Samsung Electronics supplied industry-first samples of HBM4E in May 2026
  • ▪Samsung Electronics' HBM4 doubles the input/output count to 2,000 pins and utilizes a 4-nanometer FinFET base die to increase bandwidth by over 200 percent

Subtopics

AI chip manufacturing1Compute, chips & AI infrastructure1

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