Samsung Electronics Secures $200 Billion Broadcom Partnership for AI Chips and Foundry Services Through 2030

Jul 25, 2026

Samsung Electronics signed a $200 billion memorandum of understanding with Broadcom through 2030 to collaborate on memory, foundry services, and advanced packaging for AI infrastructure. Announced at the AI Summit in San Francisco, the deal includes supplying HBM4 and HBM4E memory and manufacturing Broadcom's next-generation chips using Samsung's sub-2-nanometer process. Additionally, Samsung SDS partnered with Anthropic to deploy Claude Enterprise to 70,000 employees across 20 affiliates.

Samsung-Broadcom $200B partnership

▪The agreement aims to support next-generation artificial intelligence infrastructure by combining Samsung Electronics' memory, foundry, and packaging capabilities with Broadcom's connectivity technologies
▪The partnership agreement between Samsung Electronics and Broadcom was announced at the AI Summit held at The Midway in San Francisco
▪Samsung Electronics signed a memorandum of understanding with Broadcom on July 25, 2026, for a strategic partnership valued at over $200 billion through 2030

HBM memory for AI accelerators

▪Samsung Electronics will supply advanced High Bandwidth Memory solutions, including HBM4 and HBM4E, for Broadcom's next-generation artificial intelligence accelerators
▪Samsung Electronics began mass-producing and shipping HBM4 in February 2026, utilizing 10-nanometer-class sixth-generation DRAM and 4-nanometer base die technology
▪Samsung Electronics supplied industry-first samples of HBM4E in May 2026

2nm foundry manufacturing collaboration

▪The collaboration between Samsung Electronics and Broadcom includes advanced packaging technologies based on Samsung's 2-nanometer process, such as 2.3D and 2.5D integration
▪Samsung Electronics and Broadcom will collaborate on sub-2-nanometer process technologies for Broadcom's products, including Wireless Broadband Communications solutions

Samsung-AMD HBM4 co-design

▪Samsung Electronics HBM4 memory is being shipped inside Advanced Micro Devices Instinct MI455X graphics processing units and the Helios artificial intelligence platform
▪Samsung Electronics' HBM4 doubles the input/output count to 2,000 pins and utilizes a 4-nanometer FinFET base die to increase bandwidth by over 200 percent

Samsung enterprise AI expansion

▪Samsung SDS signed a strategic partnership agreement with Anthropic on July 24, 2026, to develop artificial intelligence-driven businesses in South Korea
▪Under the agreement with Anthropic, Samsung SDS is rolling out Claude Enterprise to 20 Samsung Group affiliates and approximately 70,000 employees