AI chip manufacturing stories

Jul 25, 2026

Samsung Electronics Secures $200 Billion Broadcom Partnership for AI Chips and Foundry Services Through 2030

Broadcom and Samsung Electronics signed a $200 billion MOU through 2030 covering AI chip production, 2nm foundry manufacturing, advanced packaging, and HBM supply. The deal was announced at the AI Summit in San Francisco.

Jul 25, 2026·8 sources

Jun 18, 2026

Trump Says Apple and Intel Reach Deal on US Chip Design and Manufacturing Partnership

President Trump announced that Intel and Apple have agreed to a partnership for designing and building chips in the United States, sending Intel shares up 9% in premarket trading.

Jun 18, 2026·2 sources

Top claims

▪Samsung Electronics began mass-producing and shipping HBM4 in February 2026, utilizing 10-nanometer-class sixth-generation DRAM and 4-nanometer base die technology.
▪Samsung Electronics supplied industry-first samples of HBM4E in May 2026.
▪Samsung Electronics' HBM4 doubles the input/output count to 2,000 pins and utilizes a 4-nanometer FinFET base die to increase bandwidth by over 200 percent.

People involved

Donald Trump

Subtopics

High Bandwidth Memory (HBM)Compute, chips & AI infrastructure US Industrial Policy Trump administration

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Trump Says Apple and Intel Reach Deal on US Chip Design and Manufacturing Partnership

Jun 18, 2026·2 sources

AI chip manufacturing stories

Samsung Electronics Secures $200 Billion Broadcom Partnership for AI Chips and Foundry Services Through 2030

Trump Says Apple and Intel Reach Deal on US Chip Design and Manufacturing Partnership

Related timelines

US Congress

Venture capital funding

Iran War

Strait of Hormuz blockage

Trump administration

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Trump Says Apple and Intel Reach Deal on US Chip Design and Manufacturing Partnership