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Sep 16, 2026

SK Hynix in talks with Intel to manufacture memory chips in US for first time

South Korea's SK Hynix is negotiating with Intel about a deal to produce memory chips on U.S. soil for the first time, according to sources familiar with the discussions. The potential collaboration would mark a significant shift for the South Korean memory chip manufacturer.

Sep 16, 2026·5 sources
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Aug 27, 2026

SK Hynix breaks ground on Indiana AI chip facility

SK Hynix held a groundbreaking ceremony for its advanced memory packaging facility in Indiana, planning to begin volume production of HBM4E chips in Q3 2029 as part of efforts to rebuild domestic AI chip supply chains.

Aug 27, 2026·3 sources
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Jul 23, 2026

Nvidia and Amkor Sign $1.5 Billion Advanced Chip Packaging Agreement

In July 2026, Nvidia and Amkor Technology signed a $1.5 billion multi-year deal to expand advanced chip packaging and testing capacity in the United States, supporting next-generation AI infrastructure. Amkor shares rose approximately 17% in after-hours trading on the news.

Jul 23, 2026·7 sources
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Top claims

  • ▪SK Hynix stated that it is reviewing various measures to strengthen its memory business, including establishing additional production bases, but no agreements have been finalized.
  • ▪South Korean chipmaker SK Hynix is in exploratory talks with Intel to manufacture memory chips in the United States for the first time.
  • ▪SK Hynix is constructing a $4 billion advanced packaging facility in West Lafayette, Indiana, which is scheduled to package high-bandwidth memory chips by 2030 but will not manufacture foundational wafers.

Subtopics

Semiconductor manufacturing3Compute, chips & AI infrastructure2AI1AI Data Center Gold Rush1US Industrial Policy1

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