Nvidia and Amkor Sign $1.5 Billion Advanced Chip Packaging Agreement

Nvidia Corp. and Amkor Technology Inc. announced a $1.5 billion multi-year strategic partnership to expand advanced semiconductor packaging and testing capacity in the United States, including Arizona. Under the agreement, Nvidia will provide a prepayment to support Amkor’s U.S. capacity expansion, while the companies will align their technology roadmaps to develop high-density interconnects and next-generation heterogeneous integration for AI and accelerated-computing platforms. Amkor shares surged up to 17% in extended trading following the announcement.

Nvidia-Amkor packaging partnership

• ▪Nvidia Corp. and Amkor Technology Inc. entered a multi-year strategic partnership worth $1.5 billion to expand advanced semiconductor packaging and testing capacity in the United States.
• ▪Amkor Technology Inc. shares surged between 12% and 17% in extended trading following the announcement of the partnership with Nvidia Corp. on July 23, 2026.
• ▪Nvidia Corp. will provide a $1.5 billion prepayment to Amkor Technology Inc. to support the expansion of Amkor's advanced packaging operations, including capacity in Arizona.

AI infrastructure demand drivers

• ▪The partnership between Nvidia Corp. and Amkor Technology Inc. aims to improve supply chain resilience for critical computing hardware amid surging global demand for artificial intelligence infrastructure.
• ▪Amkor Technology Inc. already supplies advanced packaging for Nvidia Corp.'s product portfolio, including data center processors, networking chipsets, and accelerated computing platforms.

U.S. semiconductor manufacturing expansion

• ▪Amkor Technology Inc. is collaborating with Advanced Micro Devices to package the semiconductor company's chips as part of its domestic packaging expansion.
• ▪In June 2026, Amkor Technology Inc. entered a 10-year partnership with TSMC to enhance semiconductor packaging capabilities in the United States.

Advanced packaging technology roadmap

• ▪The joint engineering roadmap between Nvidia Corp. and Amkor Technology Inc. will align product roadmaps to advance next-generation artificial intelligence and accelerated-computing platforms.
• ▪Nvidia Corp. and Amkor Technology Inc. will jointly develop packaging and testing technologies, focusing on high-density interconnects and advanced heterogeneous integration to combine different chips into a single package.

Executive statements on AI

• ▪Nvidia Corp. Executive Vice President of Operations Debora Shoquist stated that artificial intelligence is driving a generational shift in technology, creating an opportunity to reinvigorate American manufacturing and supply chains.
• ▪Amkor Technology Inc. Chief Executive Officer Kevin Engel stated that the strategic partnership with Nvidia Corp. underscores the central role advanced packaging plays in enabling the future of artificial intelligence.

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