Sep 8, 2026
ASML, TSMC, Samsung and Intel form consortium to develop 12-inch photomasks for AI chips
Major chipmakers have committed to ASML's initiative to transition from 6-inch to 12-inch photomasks, forming the Large Mask Consortium to address throughput limitations in high-NA EUV lithography systems. The move aims to eliminate stitching constraints that currently prevent the newest machines from printing the largest AI chips.
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