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Aug 4, 2026

SK hynix and SanDisk Release First High Bandwidth Flash (HBF) Standard Specification for AI Systems

SK hynix and SanDisk unveiled the first technical specification for High Bandwidth Flash (HBF), a new memory technology designed to bridge the performance gap between HBM and SSDs in AI accelerators, offering up to 3 TB/s bandwidth and terabyte-scale capacity. The specification was announced at the FMS 2026 conference, six months after the consortium's formation, with support from Google and Tenstorrent.

Aug 4, 2026·8 sources
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Top claims

  • ▪SK hynix and SanDisk released the first standard technical specification for High Bandwidth Flash (HBF) through the Open Compute Project (OCP) on August 4, 2026.
  • ▪The commercial success of HBF depends on whether accelerator vendors integrate required interfaces, software frameworks support efficient data placement, and sampled devices meet latency and power targets.
  • ▪The HBF specification adopts the Universal Chiplet Interconnect Express (UCIe) standard as its physical and protocol-level host interface.

Topics

AI acceleratorsMemory technologyAI hardwareCompute, chips & AI infrastructure