TSMC is considering entering the advanced memory chip market by drafting plans to manufacture 3D DRAM at the request of its major customer Nvidia. Led by TSMC Vice President Hsu Kuo-chin, the potential move responds to persistent global AI memory shortages expected to last into 2028. Entering memory production would expand TSMC's role in the hardware supply chain and place it in direct competition with established giants Samsung, SK Hynix, and Micron.
TSMC exploring 3D DRAM manufacturing
- ▪TSMC Vice President Hsu Kuo-chin is leading the efforts to draft plans for 3D DRAM manufacturing, which could involve building new factories or buying and converting an existing plant
- ▪Manufacturing 3D DRAM would put TSMC into direct competition with existing memory industry leaders Samsung, SK Hynix, and Micron
- ▪At the request of Nvidia, TSMC has begun drafting plans to enter the advanced memory chip market by manufacturing 3D DRAM, which stacks memory cells vertically to increase capacity and performance
Memory shortages and market impacts
- ▪Apple raised Mac and iPad prices in June 2026 due to rising memory costs, while Elon Musk announced plans for a $55 billion chip plant to reduce reliance on Micron
- ▪Surging demand for artificial intelligence data centers has created a global memory chip shortage and pushed prices higher, with Micron expecting the shortage to persist into 2028
Story comments
Loading comments…