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Aug 4, 2026

SK hynix and SanDisk Release First High Bandwidth Flash (HBF) Standard Specification for AI Systems

SK hynix and SanDisk unveiled the first technical specification for High Bandwidth Flash (HBF), a new memory technology designed to bridge the performance gap between HBM and SSDs in AI accelerators, offering up to 3 TB/s bandwidth and terabyte-scale capacity. The specification was announced at the FMS 2026 conference, six months after the consortium's formation, with support from Google and Tenstorrent.

Aug 4, 2026·8 sources
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Jul 25, 2026

SK Group and Nvidia Announce $500 Billion-Plus AI Infrastructure and Memory Initiative

Nvidia and South Korea's SK Group unveiled a strategic partnership valued at over $500 billion, encompassing large-scale AI data center development and a long-term supply agreement for next-generation memory chips from SK Hynix.

Jul 25, 2026·7 sources
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Top claims

  • ▪The HBF specification defines three performance grades with read bandwidth ranging from approximately 0.4 TB/s to 3.0 TB/s.
  • ▪SK hynix and SanDisk released the first standard technical specification for High Bandwidth Flash (HBF) through the Open Compute Project (OCP) on August 4, 2026.
  • ▪The commercial success of HBF depends on whether accelerator vendors integrate required interfaces, software frameworks support efficient data placement, and sampled devices meet latency and power targets.

Topics

AI acceleratorsMemory technologyAI hardwareCompute, chips & AI infrastructureBusiness & enterprise AI
Semiconductor manufacturing
AI startups

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