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d-Matrix unveils Raptor AI accelerator with 100 TB/s bandwidth using stacked DRAM architecture
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d-Matrix unveils Raptor AI accelerator with 100 TB/s bandwidth using stacked DRAM architecture

Aug 24, 2026

At Hot Chips 2026, Santa Clara startup d-Matrix unveiled Raptor, a 3D DRAM accelerator designed to bypass the AI memory wall. By bonding a TSMC 4nm logic die directly onto a custom DRAM die using vertical microbumps at a 36-micron pitch, Raptor achieves 100 TB/s of bandwidth from 32GB of capacity. This architecture slashes interface energy to 0.37 pJ/bit—roughly six times lower than HBM3—directly targeting the power-hungry autoregressive decode phase of frontier-class models.

Raptor stacked DRAM architecture

  • ▪The d-Matrix Raptor architecture features a TSMC 4nm compute logic die bonded face-to-face on top of a custom-designed DRAM die.
  • ▪At Hot Chips 2026, d-Matrix unveiled Raptor, a 3D DRAM accelerator for generative AI inference that delivers 100 TB/s of memory bandwidth from 32GB of capacity per card.
  • ▪An ISCA 2026 paper co-written by d-Matrix and the University of British Columbia projects that the Raptor architecture delivers approximately 4.7 times higher throughput per card than HBM-based designs.

Memory wall in inference

  • ▪In AI inference at scale, the memory wall is the primary driver of high costs, power consumption, and user concurrency constraints in GPU clusters running frontier models.
  • ▪The memory wall, first described in a 1995 paper by Wulf and McKee, represents the widening performance gap between processor speed and memory bandwidth.

HBM interposer energy cost

  • ▪The physical interface driving signals across a centimeter-scale silicon interposer in High Bandwidth Memory systems consumes approximately 2 to 3 picojoules per bit.
  • ▪Pushing a hypothetical HBM4 system to 100 terabytes per second of bandwidth would consume nearly 2 kilowatts of power for the memory interface alone.

Vertical microbump integration

  • ▪The vertical microbump interface in the d-Matrix Raptor operates at an energy cost of 0.37 picojoules per bit, which is roughly six times lower than HBM3 across an interposer.
  • ▪The d-Matrix Raptor connects its logic and DRAM dies using sub-millimeter vertical microbumps at a 36-micron pitch, bypassing the need for a silicon interposer.
  • ▪The logic-on-top orientation of the d-Matrix Raptor allows a liquid-cooling cold plate to contact the logic die directly, protecting the thermally sensitive DRAM below.

Stream blocking bandwidth optimization

  • ▪To prevent overfetch, d-Matrix's stream blocking technique aggregates four 96-byte DRAM accesses to assemble exactly three 128-byte flits for Raptor's 256 tensor engines.
  • ▪The d-Matrix Raptor uses a stream flipping technique to compare each flit to the previous one and invert when it reduces transitions, saving 20% in I/O power.

Autoregressive decode bottleneck

  • ▪A workload of 64 simultaneous users at a one million-token context window generates approximately 935 gigabytes of key-value cache in addition to model weights.
  • ▪During the autoregressive decode phase of large language models, compute cores sit largely idle because the chip must read massive model weights and KV cache from memory on every step.

2 sources

Tomshardware
Hot Chips 2026: d-Matrix stacks AI accelerator directly on custom DRAM for 100 TB/s per card — TSMC 4nm compute die bonded face-to-face at a 36-micron pitch on top of a custom-designed die
View source article
Techtimes
d-Matrix Raptor Delivers 100 TB/s From Stacked DRAM at Fraction of HBM Energy Cost
View source article

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AI inference (scaling)Compute, chips & AI infrastructureAI accelerators

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